
Basics of Place and Route in ASIC Physical DesignDesigning an ASIC (Application Specific Integrated Circuit) is like building a complex city where billions of tiny “buildings” (transistors and standard cells) must be arranged wisely, roads (wires) must connect them efficiently, and traffic (signals) must flow at the right times. In VLSI terminology, this whole physical layout process is called Place and Route (P&R), one of the most crucial stages in ASIC physical design.
As chips incorporate advanced features like AI accelerators, heterogeneous computing, multi-power domains, and chiplets, the Place and Route process has evolved dramatically. This blog simplifies the basics of Place and Route for beginners, explains why it matters, and highlights the latest industry practices shaping how modern ASICs are built.
What Is Place and Route?
Place and Route (P&R) refers to the physical implementation stages of an ASIC, where:
- Placement: Standard cells, macros, memories, and I/O elements are placed on the silicon die with legal positioning.
- Routing: Interconnects (the wires) are created to connect these placed elements according to the netlist and timing goals.
Together, Place and Route transforms the logical representation of the design (netlist from synthesis) into a physical layout (GDSII/OASIS) that can be fabricated.
In short:
Placement = Where do components go?
Routing = How are they connected?
Why Place and Route (P&R) Matters
ASIC designs are no longer simple two-domain layouts. Modern challenges include:
Multi-Domain Heterogeneous SoCs
AI accelerators, RISC-V cores, CPU clusters, and specialized DSP blocks on the same die require careful physical partitioning.
Power & Clock Complexity
Multiple power rails, clock domains, and DVFS (Dynamic Voltage and Frequency Scaling) constraints make physical implementation harder.
Routing Congestion & Signal Integrity
On advanced nodes like 3nm–2nm, interconnect delay and crosstalk dominate performance, making routing optimizations critical.
AI-Assisted P&R Tools
Next-gen tools use machine learning to optimize placement and routing decisions dynamically.
Understanding these dynamics will make you a more effective ASIC designer or physical design engineer.
The Place and Route Flow (Step by Step)
Let’s walk through the main stages of P&R in a clear and up-to-date way.
1. Physical Synthesis (Optional Pre-P&R)
Some flows apply physical synthesis to optimize logic with physical constraints in mind, adjusting gate sizes, restructuring logic, and creating better nets for timing and area.
This helps the upcoming placement stage by giving a better initial physical view of design.
2. Floorplanning
Floorplanning defines:
- Core area
- Block boundaries
- Power and clock regions
- Macro placements (memory, hard IPs, SERDES)
Floorplanning increasingly relies on AI-assisted proposals that balance timing, congestion, and power.
Key Outputs of Floorplan:
- Block sizes and shapes
- Power grid plan (UPF / CPF integration)
- Initial placement constraints
3. Placement
Placement is the step where:
- Standard cells and macros are positioned
- Congestion and proximity to timing critical paths are considered
Modern placement uses:
- Clustering to group related cells
- Timing-driven strategies to optimize critical nets
- Power awareness to reduce hot spots
Tools from Synopsys, Cadence, and Siemens EDA use physical analysis engines to iteratively refine placement based on congestion, timing, and power.
Placement Objectives:
- Minimize global and local wirelength
- Meet setup and hold timing constraints
- Balance power distribution and thermal impact
4. Clock Tree Synthesis (CTS)
While sometimes treated as a separate step, CTS is tightly coupled with placement. It builds the clock distribution network to:
- Minimize skew
- Balance latency across domains
- Support clock gating and low-power modes
CTS quality determines whether timing closure is possible in later stages.
5. Routing
Once placement is acceptable, routing begins.
Global Routing
Routes signals at a macro level, deciding which regions the wires will travel.
Detailed Routing
Physically routes wires with exact geometries while obeying DRCs (Design Rule Checks) and avoiding congestion.
Modern routers support:
- Crosstalk mitigation
- Shielding for high-speed nets
- Multi-layer optimization
- Multi-corner awareness
Good routing minimizes delay and ensures signal integrity.
6. Optimization, ECO & Timing Closure
After routing, final adjustments (ECOs — Engineering Change Orders) are done:
- Fix timing violations
- Adjust buffer insertion
- Optimize nets for power or area
Tools now provide auto-ECO features that use data analysis and AI to suggest changes that improve timing.
7. DRC/LVS and Signoff Checks
The final layout must be checked against:
- DRC (Design Rule Check) – Manufacturability rules
- LVS (Layout vs Schematic) – Ensures the layout matches the logical intent
- Antenna violations
- Power integrity checks (IR drop, EM)
Signoff engines are integrated with cloud-based regression to handle multiple PVT corners.
Key Concepts in Place and Route
Congestion
Regions of the chip where too many wires cross, making routing hard.
Solutions:
- Adjust placement
- Add buffering
- Use advanced routing layers intelligently
Timing Closure
Making setup and hold times meet constraints across all corners and modes.
Strategies:
- Buffer tuning
- Gate resizing
- Path restructuring
Power Awareness
Modern P&R tools integrate power constraints from formats like UPF (Unified Power Format).
This ensures:
- Low-power modes don’t violate design constraints
- Power rail distribution is valid
Multi-Corner Multi-Mode (MCMM)
Verification across multiple conditions:
- Voltages
- Temperatures
- Frequencies
- Power states
Routing and CTS must satisfy timing across all these modes.
Tools Commonly Used
Here’s an updated list of tools that dominate the P&R landscape:
|
Purpose |
Tools |
|
Placement |
Synopsys IC Compiler III, Cadence Innovus, Siemens Olympus |
|
Routing |
Cadence Innovus Detailed Routing, IC Compiler, Calibre LFD |
|
CTS & Timing |
PrimeTime, Tempus, Fusion STA, Innovus |
|
Power |
Voltus, FusePower |
|
DRC/LVS |
Calibre nmDRC/LVS, PVS |
These tools often integrate Python APIs for automation and data analysis.
Practical Tips for Freshers
If you’re just getting started, here’s how you can build intuition and skill quickly:
Learn Timing Constraints Early
Knowing how to write and interpret SDC (Synopsys Design Constraints) is crucial.
Understand Power Formats (UPF)
Low power is everywhere; UPF is no longer optional. Learn how to integrate power intent early.
Analyze Reports Carefully
Tools produce multiple reports:
- Timing (setup/hold)
- Congestion
- Power
- DRC/LVS
Learning how to read them accelerates debugging.
Use Visualization Tools
Visual feedback (heatmaps, clock trees, routing density) helps you see problems before they become failures.
Practice with Small Designs
Start with small modules: FIFOs, ALUs, simple controllers. Gradually scale up to block-level designs.
Common Challenges and Solutions
|
Challenge |
Solution |
|
High routing congestion |
Spread placement, buffer nets |
|
Timing failures |
Adjust gate sizing, buffer insertion |
|
Power violations |
Re-balance power grid, optimize routing |
|
Multi-domain timing |
Reinforce CTS and timing budgets |
Why Place and Route Skills Matter
Companies are looking for engineers who:
- Understand P&R flows end-to-end
- Can analyze and interpret complex reports
- Automate flows using Python/TCL
- Balance timing, power, and area in physically constrained designs
These skills open doors to roles in physical design, STA (Static Timing Analysis), DFT, and CAD automation.
Conclusion
Place and Route is where logic becomes silicon. It’s a complex, data-driven stage that balances timing, power, congestion, and manufacturability. By understanding the basics—from placement and clocking to routing and optimization—you’ll build a strong foundation for a career in ASIC physical design.
Remember:
- Start with strong constraint knowledge
- Practice interpreting metrics
- Learn to use modern tools effectively
- Embrace automation and scripting
With these skills, you’ll be well-prepared for the challenges of tomorrow’s semiconductor landscapes.
Want to Level Up Your Skills?
Recent Blogs
EXPLORE BY CATEGORY
End Of List
No Blogs available VLSI
© 2025 - VLSI Guru. All rights reserved
Explore a wide range of VLSI and Embedded Systems courses to get industry-ready.
50+ industry oriented courses offered.

Explore a wide range of VLSI and Embedded Systems courses to get industry-ready.
50+ industry oriented courses offered.







